For high speed digital (HSD) integrated circuits (ICs) used in Serializer/Deserializer (SerDes) systems, signal integrity (SI) engineers often convert such circuits into Input/Output Buffer Information specification (IBIS) models to achieve fast simulations for evaluation and performance prediction. One common modeling task is to model the interconnects between board level components. These interconnects are often modeled using a combination of resistors (R ), inductors (L), capacitors (C ) and transmission lines (TL). One common package modeling specification is the Package Model (PKG) specification defined in the IBIS 5.1 document.
This paper shows how to use PKG data in the Agilent EEsof Advanced Design System (ADS) Channel Simulator.
See the full article: Using_IBIS_Package_Data_in_ADS.pdf
Download the application archive file: Using_PKG_Files.7z
